Moldflow在电子芯片封装上的运用 下载
- 文件类型：
- 芯片设计资料下载，芯片设计
- 文件大小：
- 776 KB
- 下载次数：
- [246次]
- 日期：
- 04-06
- 解压密码：
- www.dianzi6.com
- Tag:
- 芯片设计,芯片设计资料下载 Moldflow 芯片 电子 封装
- 运行平台：
- txt/doc/word/ppt/pdf 等
- 星级：
-
-
简介：
正文：
Moldflow的芯片封装解决方案，Moldflow Microchip Encapsulation Solution
Moldflows wire-sweep analyzes the deformation of bonding wires that connect the chip to the leadframe during encapsulation.
Uses numerical simulation method to get accurate calculation of wire sweep.
Flow analysis using Moldflows Reactive Molding to obtain fluid velocity and viscosity around the wires
Flow analysis calculates drag force along the wire
Wire deformation analysis calculates wire deformation
如果觉得《Moldflow在电子芯片封装上的运用》不错，可以推荐给好友哦。
正文：
Moldflow在电子芯片封装上的运用，文件名：moldflow icchip.ppt
Moldflow的芯片封装解决方案，Moldflow Microchip Encapsulation Solution
Moldflows wire-sweep analyzes the deformation of bonding wires that connect the chip to the leadframe during encapsulation.
Uses numerical simulation method to get accurate calculation of wire sweep.
Flow analysis using Moldflows Reactive Molding to obtain fluid velocity and viscosity around the wires
Flow analysis calculates drag force along the wire
Wire deformation analysis calculates wire deformation
如果觉得《Moldflow在电子芯片封装上的运用》不错，可以推荐给好友哦。
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