电子组装的IPC标准列表

电子组装的IPC标准列表
IPC-T-50GTerms and Definition for Interconnecting and Packaging Electronic Circuits
电子电路互连与封装的定义和术语 IPC-TM-650Test Methods Manual
试验方法手册IPC/EIA J-STD-001CRequirements for Soldered Electrical & Electronic Assemblies
电气与电子组装件锡焊要求IPC-HDBK-001Handbook and Guide to Supplement J-STD-001—Includes Amendment 1
J-STD-001辅助手册及指南及修改说明1
IPC-A-610DAcceptability of Electronic Assemblies
印制板组装件验收条件
IPC-HDBK-610Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison
IPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-EA-100-KElectronic Assembly Reference Set
电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。IPC/WHMA-A-620Requirements and Acceptance for Cable and Wire Harness Assemblies
电缆和引线贴装的要求和验收IPC/EIA J-STD-012Implementation of Flip Chip and Chip Scale Technology
倒装芯片及芯片级封装技术的应用
IPC-SM-784Guidelines for Chip-on-Board Technology Implementation
芯片直装技术实施导则
IPC/EIA J-STD-026Semiconductor Design Standard for Flip Chip Applications
倒装芯片用半导体设计标准
J-STD-027Mechanical Outline Standard for Flip Chip and Chip Size Configurations
FC（倒装片）和CSP(芯片级封装)的外形轮廓标准
IPC/EIA J-STD-028Performance Standard for Construction of Flip Chip and Chip Scale Bumps
倒装芯片及芯片级凸块结构的性能标准J-STD-013Implementation of Ball Grid Array and Other High Density Technology
球栅阵列 (BGA)及其它高密度封装技术的应用
IPC-7095Design and Assembly Process Implementation for BGAs
球栅阵列的设计与组装过程的实施
IPC/EIA J-STD-032Performance Standard for Ball Grid Array Balls
BGA球形凸点的标准规范
IPC-MC-790Guidelines for Multichip Module Technology Utilization
多芯片组件技术应用导则
IPC-M-108Cleaning Guides and Handbook Manual
清洗导则和手册IPC-5701Users Guide for Cleanliness of Unpopulated Printed Boards
非密集型印制板清洁应用导则 IPC-TP-1113Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?
电路板离子洁净度测量：它告诉我们什么？
IPC-CH-65AGuidelines for Cleaning of Printed Boards & Assemblies
印制板及组装件清洗导则
IPC-SC-60APost Solder Solvent Cleaning Handbook
锡焊后溶剂清洗手册IPC-SA-61APost Solder Semi-aqueous Cleaning Handbook
锡焊后半水溶剂清洗手册IPC-AC-62AAqueous Post Solder Cleaning Handbook
锡焊后水溶液清洗手册IPC-TR-476AElectrochemical Migration: Electrically Induced Failures in Printed
Circuit Assemblies
电化学迁移：印制电路组件的电气诱发故障
IPC-TR-582Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air
IPC第3阶段非清洗助焊剂研究IPC-TR-583An In-Depth Look At Ionic Cleanliness Testing
深入离子洁净度测试IPC-9201Surface Insulation Resistance Handbook
表面绝缘电阻手册IPC-TP-104-KCleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,
Part 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分
IPC-M-109Component Handling Manual
元件处理手册IPC/JEDEC J-STD-020CMoisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
非密封固态表面贴装器件湿度／再流焊敏感度分类IPC/JEDEC J-STD-033AHandling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用IPC/JEDEC J-STD-035Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
非气密封装电子元件用声波显微镜IPC-DRM-18GComponent Identification Desk Reference Manual
零件分类标识手册IPC-DRM-SMT-CSurface Mount Solder Joint Evaluation Desk Reference Manual
接插件焊接点评价手册IPC-DRM-40EThrough-Hole Solder Joint Evaluation Desk Reference Manual
接插件焊接点评价手册
IPC-DRM-56Wire Preparation & Crimping Desk Reference Manual
导线和端子预成形参考手册
IPC-DRM-53Introduction to Electronics Assembly Desk Reference Manual
电子组装基础介绍手册
IPC-M-103Standards for Surface Mount Assemblies Manual
所有SMT标准合订本IPC-M-104Standards for Printed Board Assembly Manual
10种常用印制板组装标准合订本IPC-TA-722Technology Assessment of Soldering
锡焊技术精选手册IPC-TA-723Technology Assessment Handbook on Surface Mounting
表面安装技术精选手册IPC-TA-724Technology Assessment Series on Clean Rooms
清洁室技术精选系列IPC-SM-780Component Packaging and Interconnecting with Emphasis on Surface Mounting
以表面安装为主的元件封装及互连导则IPC-SM-785Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
表面安装焊接件加速可靠性试验导则IPC-9701Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
表面安装锡焊件性能试验方法与鉴定要求IPC/JEDEC-9702Monotonic Bend Characterization of Board-Level Interconnects
平板互连的单一弯曲特性IPC-PD-335Electronic Packaging Handbook
电子封装手册IPC-7525Stencil Design Guidelines
网版设计导则IPC-QL 365ACertification of Facilities That Inspect/Test Printed Boards, Components and Materials
印制板, 元件和材料检验/试验企业的授证
IPC-9191General Guidelines for Implementation of Statistical Process Control
统计过程控制导则 IPC-TR-581IPC Phase III Controlled Atmosphere Soldering Study
IPC第3阶段受控气氛焊接研究
IPC-MI-660Incoming Inspection of Raw Materials Manual
原材料接收检验手册IPC/EIA J-STD-004ARequirements for Soldering Fluxes-Includes Amendment 1
锡焊焊剂要求（包括修改单1）
IPC/EIA J-STD-005Requirements for Soldering Pastes-Includes Amendment 1
焊膏技术要求（包括修改单1）
IPC-HDBK-005Guide to Solder Paste Assessment
焊膏性能评价手册IPC/EIA J-STD-006ARequirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求IPC-SM-817General Requirements for Dielectric Surface Mounting Adhesives
表面安装用介电粘接剂通用要求
ELEC-SOLDERModern Solder Technology for Competitive Electronics Manufacturing
电子制造的最新焊接技术IPC-WP-006Round Robin Testing & Analysis: Lead-Free Alloys-Tin, Silver, & Copper
无铅焊料合金锡-银-铜的试验和分析求IPC-CA-821General Requirements for Thermally Conductive Adhesives
导热胶粘剂通用要求
IPC-3406Guidelines for Electrically Conductive Surface Mount Adhesives
表面贴装导电胶使用指南
IPC-3408General Requirements for Anisotropically Conductive Adhesives Films
各向异性导电胶膜的一般要求
IPC-CC-830BQualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
印制板组装电气绝缘性能和质量手册IPC-HDBK-830Guideline for Design, Selection and Application of Conformal Coatings
敷形涂层的设计，选择和应用手册
IPC-SM-840CQualification and Performance of Permanent Solder Mask - Includes Amendment 1
永久性阻焊剂的鉴定及性能(包括修改单1)IPC-HDBK-840Guide to Solder Paste Assessment
焊膏性能评价手册ELEC-MICROHandbook of Lead Free Solder Technology for Microelectronic Assemblies
微电子组装无铅焊接技术手册IPC-TP-1114The Layman’s Guide to Qualifying a Process to J-STD-001
基于J-STD-001组装工艺雷氏选择法
IPC-AJ-820Assembly & Joining Handbook
装联手册IPC-7530Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
大规模焊接(回流焊与波峰焊)过程温度曲线指南IPC-TP-1090The Layman’s Guide to Qualifying New Fluxes
新型助焊剂雷氏选择法IPC-TP-1115Selection and Implementation Strategy for a Low-Residue No-Clean Process
低残留不清洗工艺的选择和实施IPC-S-816SMT Process Guideline & Checklist
表面安装技术过程导则及检核表IPC-TR-460ATrouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
印制板波峰焊故障排除检查表IPC-CM-770EComponent Mounting Guidelines for Printed Boards
印制板元件安装导则
IPC-7912ACalculation of DPMO & Manufacturing Indices for Printed Board Assemblies
印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算
IPC-9261In-Process DPMO and Estimated Yield for PWAs
印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-DPMO-202IPC-7912/9261 End Item and In Process DPMO Set
IPC-7912A 和IPC-9261合订本IPC-9500-KAssembly Process Component Simulations, Guidelines & Classifications Package
组装过程中元件仿真, 规则分类IPC-9501PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价IPC-9502PWB Assembly Soldering Process Guideline for Electronic Components
电子元件的印制板组装焊接过导则
IPC-9503Moisture Sensitivity Classification for Non-IC Components
非集成电路元件的湿度敏感度分级
IPC-9504Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
非集成电路元件的组装过程模拟评价（非集成电路元件预处理）
IPC-9850-KSurface Mount Placement Equipment Characterization-KIT
表面贴装设备性能检测方法的描述（附Gerber格式CD盘）
IPC-9850-TM-KW, IPC-9850-TM-KTest Materials Kit for Surface Mount Placement Equipment Standardization
表面贴装设备性能测试用的标准工具包
• 4 IPC-9850 Placement Accuracy Verification Panels
• 1 IPC-9850 CMM Measurement Verification Panels
• 150 IPC-9850 QFP-100 Glass Components
• 130 IPC-9850 QFP-208 Glass Components
• 150 IPC-9850 BGA-228 Glass Components
• NIST Traceable Measurement Certificate
• Custom Storage Case
IPC-7711/21A电子组装件的返工与返修IPC/EIA J-STD-002BSolderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
元件引线、端子、焊片、接线柱及导线可焊性试验IPC/EIA J-STD-003ASolderability Tests for Printed Boards
印制板可焊性试验IPC-TR-461Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
印制板波峰焊故障排除检查表
IPC-TR-462Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage
带保护性涂层印制板长期贮存的可焊性评价IPC-TR-464Accelerated Aging for Solderability Evaluations
可焊性加速老化评价(附修订)IPC-TR-465-1Round Robin Test on Steam Ager Temperature Control Stability
蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2The Effect of Steam Aging Time and Temperature on Solderability Test Results
蒸汽老化时间与温度对可焊性试验结果的影响IPC-TR-465-3Evaluation of Steam Aging on Alternative Finishes, Phase IIA
替代涂覆层的蒸汽老化评价
IPC-TR-466Technical Report: Wetting Balance Standard Weight Comparison Test
技术报告: 润湿天平称重标准对比测试
SMC-WP-001Soldering Capability White Paper Report
可焊性工艺导论SMC-WP-005PCB Surface Finishes
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