板级应用笔记的DFN和QFN封装 下载
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- 电源技术资料下载，电源技术
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- 1.68 MB
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- [435次]
- 日期：
- 05-02
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- www.dianzi6.com
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- 电源技术,电源技术资料下载 DFN QFN 笔记 封装 应用
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正文：Various ON Semiconductor components are packaged in an advanced Dual or Quad Flat−Pack No−Lead package (DFN/QFN). The DFN/QFN platform represents the latest
in surface mount packaging technology, it is important that the design of the Mounting Pads of the Printed Circuit Board (PCB), Soldermask and Stencil pattern, along with the
assembly process, all follow the suggested guidelines outlined in this document.
如果觉得《板级应用笔记的DFN和QFN封装》不错，可以推荐给好友哦。
正文：Various ON Semiconductor components are packaged in an advanced Dual or Quad Flat−Pack No−Lead package (DFN/QFN). The DFN/QFN platform represents the latest
in surface mount packaging technology, it is important that the design of the Mounting Pads of the Printed Circuit Board (PCB), Soldermask and Stencil pattern, along with the
assembly process, all follow the suggested guidelines outlined in this document.
如果觉得《板级应用笔记的DFN和QFN封装》不错，可以推荐给好友哦。
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